IC Package Development Engineer (Germany)
Location: Stuttgart, Germany - Onsite working required
Must have the right to work in Germany.
As an IC Package Development Engineer, you will:
-Package Selection & Analysis – Select appropriate IC package types based on specifications and IC requirements; analyze electrical characteristics; identify potential limitations.
-Electrical Performance Optimization – Enhance electrical performance focusing on signal integrity, power integrity, and EMC; analyze routing, parasitics, and noise issues; propose design improvements.
-Design for Manufacturability & Cost Optimization – Review designs for manufacturability, assembly requirements, and materials availability; suggest cost-effective modifications.
-Documentation & Reporting – Deliver detailed reports, including diagrams, simulations, calculations, and results; clearly communicate design decisions and their impact.What We Offer:
-The opportunity to join a leading research center in nanotechnology, shaping future automotive technologies.
-A collaborative, multicultural, and inclusive working environment where initiative and responsibility are encouraged.
-Support for your technical and personal growth through dedicated development programs.
-A competitive and market-appropriate compensation package recognizing your expertise and commitment.Who You Are:
-MSc in Electronics or a related field with at least 5 years of experience in packaging design and SIPI analysis.
-Proficient in Cadence layout tools and Ansys simulation tools.
-Skilled in 2.5D/3D packaging and backend silicon layout (place & route).
-Strong communication skills in English (mandatory).
Please get in touch with Christina McGuire to hear more about this position.
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